UMC to manufacture 3G iPhone baseband chip, says paper

United Microelectronics business enterprise (UMC) will be the foundry to provide Infineon Technoloiges’ 3G baseband chip, that allows you to be used within the new Apple iPhone that helps 3G, according to a chinese language-language economic daily news (EDN) document. The baseband chip (PMB878) can be fabricated on UMC’s 65nm course of node. Taiwan Semiconductor Manufacturing company (TSMC) used to be the foundry associate for Infineon for the baseband chip used within the first-era iPhone, the paper stated. source

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